Infineon presents power module with silicon and silicon carbide technologies
It is precisely this combination of high performance and efficiency at low cost that Infineon sees as “crucial” to making electric mobility accessible to a broader market. The HybridPack Drive G2 Fusion is designed to do just that and set nothing less than “a new power module standard for traction inverters in the e-mobility sector,” as the Munich-based company confidently announced.
The focus is on the name suffix ‘Fusion.’ Infineon uses both silicon-based semiconductors and silicon carbide (SiC) chips in the new module of the ‘HybridPack Drive’ series. SiC has a higher thermal conductivity, breakdown voltage and switching speed. SiC modules therefore switch faster, have lower heat losses and are simply more efficient – which in an electric car means more range for the same battery size. However, silicon carbide is also significantly more expensive than silicon – which is why SiC power modules have so far tended to be used in premium electric cars. Cheaper volume models, on the other hand, usually use silicon semiconductors.
According to Infineon, the new module can reduce the proportion of SiC per vehicle while maintaining the same performance and efficiency of the vehicle and lowering system costs. For example, the German chip manufacturer promises that system suppliers can achieve almost the system efficiency of a complete SiC solution with just 30 per cent SiC and 70 per cent silicon.
At the same time, the familiar properties of the ‘HybridPack Drive’ modules will also be offered. It can be “quickly and easily integrated in vehicle components or modules without requiring complex adjustments or configurations.” The HybdirdPack Drive G2 Fusion module delivers up to 220 kW in the 750 V class.
“Addressing the demand for greater e-mobility range, this technological breakthrough smartly combines silicon carbide and silicon,” says Negar Soufi-Amlashi, Senior Vice President & General Manager High Voltage at Infineon’s Automotive Division. “Integrated in a well-introduced module package footprint it offers compelling cost-performance ratio over pure silicon carbide modules without adding system complexity for automotive system suppliers and vehicle manufacturers.”
Infineon will exhibit the new HybridPack Drive G2 Fusion at ‘electronica 2024’ in Munich, Germany, from 12 to 15 November (Hall C3, Stand 502).
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